HOREXS semiconductor ic package substrate With Chip Wire Bonding

Product Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

HongRuiXing (Hubei) Electronics Co.,Ltd.

Visit Website

City: Shenzhen

Country/Region: China

View Contact Details

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Contact Now

HOREXS semiconductor ic package substrate With Chip Wire Bonding

Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...

Product Tags:

Horexs Bga Circuit Board

Ultra Thin Bga Circuit Board

Bga Circuit Board With Wire Bonding

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Friendly Links: www.everychina.com