ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Product Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

HongRuiXing (Hubei) Electronics Co.,Ltd.

Visit Website

City: Shenzhen

Country/Region: China

View Contact Details

ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Contact Now

ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash ...

Product Tags:

Wire Bond BGA Substrate

ENIG BGA Substrate

IC Packaging Substrate Board

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Friendly Links: www.everychina.com